Hardware designs of Wired / Wireless Network Infrastructure Devices are being developed in Industry, Automotive and Telco standards. In this context ethernet, xDSL and fiber optic systems on the wired side, 2G / 3G / 4G-LTE, Wi-Fi, Bluetooth, below 1GHz and NFC units on the wireless side, The hardware designs of high-speed motherboards, interfaces and peripherals for the analog, digital and RF parts of the SyncE and PTP supported communication systems operating in Stratum 1-2-3 are completely made in-house.
Our hardware competencies include many interdisciplinary expertise from conceptual definitions to functional hardware blocks and then to schematic and printed circuit boards: High speed digital circuit design up to 100G, 6GHz and below RF design techniques, low voltage linear regulators, design of isolated and non-switched power supplies, programming of complex logic units such as FPGAs and multi-layer-high density impedance controlled printed circuit board design.
The designed cards are transformed into unique products without loss of performance in environments with high difficulty, noisy and electromagnetic interference. These products are verified by environmental conditions, electromagnetic and safety tests such as EMI-EMC, Surge, Burst, EFT, LVD in accredited testing institutions.
▲ Multi-Layer and High Density PCB Design (Micro, Buried and Blind Via)
▲ Layer Stacking (Stack-Up) Design
▲ Impedance Control
▲ Power Distribution Topologies
▲ Network and Signal Integrity
▲ Rigid-Flex Printed Circuit Boards
▲ Design in accordance with EMI-EMC standards
During the design process, it is shaped by customer requirements, technical specifications manually or by considering in-house targets. The hardware design process begins with a block diagram prepared for the entire resulting system. In our designs, modular design is provided by separating many sub-units such as main board, power board, connector boards, input-output cards. All the elements to be defined on our cards are transferred to our own hardware design libraries and both continuity and a rich material pool are created for the next designs.
Many structures which are schematic design power blocks, processor/microcontroller, nonvolatile memory, volatile memory, communication units (Ethernet switching, RF transceiver, fiber-keeper converter, etc.), external world or board-to-board connectors, indicators such as LED, LCD screen or button are designed in a hierarchical structure with high traceability and readability of signal flows. Before transferring to the printed circuit board in the drawing, signal groupings and line classifications are made to facilitate the drawing of settlements and waterways.
In digital circuit design, in high-speed printed circuit board design, in order to ensure signal integrity of single-ended and differential waterways, circuit ground, power lines and signal layers in layer stacking, dielectric coefficient of selected laminated materials, material-induced loss coefficients, mesh density of the material to prevent impedance discontinuity and It is selected by paying attention to its homogeneity in accordance with the high frequency signals used in the card. In order to minimize the mutual noise interaction in the drawing of electrical waterways after the PCB layout, the printed circuit drawing process is done in accordance with the distance values between the paths, the path thicknesses for the impedance-controlled lines, and the power needs of the integrated circuits used. Suitable grounding for power, high speed digital and RF lines gains importance in the printed circuit board. Considering the effect of grounding in our designs, the design is made and both the quality of the broadcast on the RF lines is increased and the unwanted emissions from the EMI-EMC printed circuit board are reduced.
Some areas where we developed BSP:
Network Devices
▲ PHY (Ethernet and Fiber)
▲ Switch IC
▲ WIFI
▲ xDSL ve VDSL2 Integrations
▲ MII, RMII, RGMII, GMII, PCI
▲ 2G/3G/4G-LTE
I2C, SPI, UART Based Integrations
▲ EEPROM, FRAM
▲ SPI, QSPI Flash
▲ Audio Codecs
▲ Temperature sensor, accelerometer, gyroscope, magnetometer, altimeter
▲ PoE Controller
▲ RF Tranceivers
USB2.0, USB3.0
MMC, NAND, NOR Flash, SD Card, MMC
MMI Interfaces
▲ LCD, 2x16, 4x20 Dot Matrix LCD
▲ TFT-LCD, e-Ink, CustomDisplay
▲ Keypads
